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ots Ad hoc-Service: TePla AG <DE0007461006> TePla signs Agreement for co-operation with Hitachi Via Mechanics, Ltd.

Kirchheim/Munich (ots Ad hoc-Service) -

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announcement.
- Co-operation with japanese market leader strengthens position in
asian printed circuit board market - Strategic emphasis in 2000 on
semiconductor and printed circuit board industry
The TePla AG signed contracts for a strategic co-operation with
the Japanese Hitachi via Mechanics, Ltd. Together with Hitachi, TePla
will develop a plasma-system for cleaning laser-drilled holes in
printed circuit boards, which will be marketed by Hitachi in
connection with their laser-drilling equipment.
Thus the TePla AG could win yet another key-Player in the printed
circuit board market for a co-operation. In the growth market for
laser-drilling equipment, Hitachi via Mechanics has a market share of
30 per cent. Advances from the co-operations are especially expected
in the asian and in particular the japanese market, in which Hitachi
is market leader for laser-drilling equipment.
First results from the co-operation are expected in 2001. The
expected turnover and revenue figures are to be upgraded accordingly.
The Strategy of TePla is to position itself as swiftly as possible
in the niche market for cleaning of laser-drilled holes in printed
circuit boards and thus to further advance its PCB Technology
division, in which revenues in the past year could be increased in by
DM 0.3 million on DM 2.0 million.
Against the background of the booming semiconductor market, apart
from the PCB Technology division TePla wants to strengthen its
Semiconductor Technology division and here especially its position in
the United States in the current financial year by means of
co-operations and akquisitions. The n egotiations in the Surface
Technology division with Plasma-Finish GmbH, Schwedt, were aborted in
mutual agreement.
End
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